Ultrasonic bonding head
AssigneeMotorola, Inc.
InventorStanley Gaicki
Life of this patent
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Abstract
A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.
Claims5
A stepped bonding head for receiving a wire having a diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation comprising:
- a. first and second recessed bonding surfaces being located at different planes from each other and separated from each other a predetermined vertical distance by a third surface, and
- b. said third surface being disposed at an angle for transversely intersecting the longitudinal axis of said wire during the bonding operation and said predetermined vertical distance being of a dimension less than that capable of shearing said wire.
Dependencies are inferred from the claim text.