Unique packaging method for use on large semiconductor devices
AssigneeThe Bendix Corporation
InventorsRaymond Walter Borden, James Edward DeBard
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Abstract
A silicon controlled rectifier having a triangular base with a planar mounting surface and holes at the apices of the angles to receive screws for mounting the rectifier to a heat sink surface. A cylindrical anode is connected to the base and a semiconductor pellet is positioned on the base within the cylindrical anode. A spring loaded cathode tube is positioned coaxially within the cylindrical anode in engagement with the semiconductor pellet and a spring loaded gate is positioned coaxially within the cathode tube in engagement with the pellet to pressure mount the pellet on the base.
Claims3
A method of assembling a semiconductor device comprising securing a diaphragm with an aperture therein by means of insulation to a ring-shaped electrode, assembling a spring member on a cylindrical electrode having a flange at one end and inserting the cylindrical electrode through the aperture in the diaphragm and attaching the cylindrical electrode to the diaphragm with the spring-like member in relaxed position between the flange and the diaphragm, assembling a tube-like member to a base and positioning a semiconductor pellet within the tube-like member on the base, positioning the flange of the cylindrical electrode on the semiconductor pellet and compressing the spring member until the ring-shaped electrode engages the tube-like member on the base, and securing the ring-shaped electrode to the tube-like member with the spring member under compression.
Dependencies are inferred from the claim text.