Electroless copper plating solution
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasahiro Oita, Hyogo Hirohata, Nobuhiro Hamasaki
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Abstract
An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.
Claims4
An electroless copper plating solution comprising 0.001 to 0.30 mole/l of copper salt, 0.001 to 0.60 mole/l of a complexing agent for cupric ions, 0.0005 to 0.75 mole/l of a reducing agent to reduce cupric ions, 0.05 to 2.0 mole/l of alkali hydroxide, and 0.001 to 1.0 g/l of R.sub.f SO.sub.2 N(R')R(C.sub.2 H.sub.4 O).sub.m H, wherein R.sub.f is a perfluoroalkyl group containing 3 to 12 carbon atoms, R is an alkylene bridging group containing 1 to 12 carbon atoms, R' is a member selected from the group consisting of a hydrogen atom and an alkyl group containing 1 to 10 carbon atoms, and m is an integer of 1 to 15.
An electroless copper plating solution according to claim 9, wherein the amount of said copper salt is 0.005 to 0.12 mole/l, the amount of said complexing agent is 0.006 to 0.35 mole/l, the amount of said reducing agent is 0.005 to 0.5 mole/l, and the amount of said alkali hydroxide is 0.1 to 0.5 mole/l.
Dependencies are inferred from the claim text.