Suction pipette and method of manufacture for receiving of semiconductor crystal plates

A method of manufacturing a suction pipette of sinterable material for receiving rectangular, including quadratic semiconductor crystal plates, the pipette being formed with a rectangular recess having a floor, walls defining the recess narrowing towards the floor, and an evacuation channel communicating with the floor, comprising the steps of:

• inserting a binder into the material to be sintered;
• fabricating first and second parts for assembly of the pipette, the first part being formed with an open channel and having first and second sidewalls defining the open channel, the second part being insertable into the first part having first and second cam-shaped end-projections formed with first and second inner walls, respectively, and first and second outer walls for making contact with the first and second sidewalls upon insertion of the second part into the first part;
• grinding the sidewalls of the first part within the region of the open channel and the outer walls of the projections to a predetermined tapered angle for at least a first portion of the first and second sidewalls, and the first and second outer walls to fittingly abut each other, respectively, upon the insertion of the second part into the first part, the inner walls and at least a second portion of the first and second sidewalls defining the recess;
• and heat treating or sintering the first and second parts upon insertion of the second part into the first part for uniting the first and second parts by diffusion of the binder within the sinterable material.