Combined semiconductor device and printed circuit board assembly
AssigneeAmerican Microsystems, Inc.
InventorJames B. Morris, Sr.
Life of this patent
Estimating the term…
Abstract
A method for combining a semiconductor device with a printed circuit board or substrate which eliminates the need for conventional semiconductor packaging and connectors for same on the board and thereby makes possible a relatively small and thin assembly adaptable for space limited electronic products. The semiconductor device is fixed to a carrier which is installed and secured within a hold in the circuit board. Terminal pads of the device are wire bonded to terminals on the substrate, and the connecting wires and die are completely encapsulated within a plastic material.
Claims22
Method of constructing a thin unitized electronic circuit by securing a large scale integrated circuit semiconductor die having a plurality of terminal pads spaced apart along the edges of a top major surface thereof within a hole in a thin and flat printed circuit board and connecting said die terminal pads to spaced apart connection pads on a top major surface of said board positioned adjacently surrounding said opening comprising the sequence of:
- a. providing a thin and flat die carrier with an external thickness closely approximating the thickness of said board and with peripheral walls surrounding a flat base thereby defining a rectangular well within said carrier which is sized so that said die fits snugly therewithin with a bottom major surface thereof oppositely adjacent said flat base;
- then
- b. attaching said semiconductor die to said die carrier entirely within said well by bonding said bottom major surface to said base;
- and then
- c. placing said die carrier containing said die into said hold in said printed circuit board which has been preformed and sized to receive said die carrier substantially entirely therewithin;
- then
- d. electrically interconnecting said terminal pads of said die and connection pads of said board with fine wires which pass adjacently across the tops of said peripheral walls;
- and then
- e. covering completely said die, the exposed surfaces of said carrier, said fine wires and the portion of said board adjacently surrounding said hole with hardcuring liquid encapsulation material.
A flat and thin unitary electronic assembly for use in electronically controlled apparatus comprising in combination:
- a. a flat and thin printed circuit substrate having conductive paths and connected components on at least one major surface thereof and originally formed with a transverse opening with connection pads of at least some of said paths spaced around the entire extent of said opening;
- b. a die carrier sized and shaped to fit substantially entirely within and occupy said substrate opening and permanently secured therein, said carrier having a continuous peripheral wall portion forming a shallow recess in a major surface of said carrier;
- c. a semiconductor die permanently attached to said carrier entirely within said recess and having a flat top surface processed to define a microelectronic circuit with electrical terminal pads spaced around the entire extent of the periphery of the top surface of said die, a flat bottom surface generally parallel to said top surface and a transverse thickness much smaller than the length or width of its top surface;
- d. electrical connection wires for directly interconnecting said terminal pads of said die to predetermined corresponding connection pads on said substrate;
- and
- e. cured encapsulation means enveloping said die, the exposed recessed portion of said die carrier, and said electrical connection wires.
Method of constructing a thin unitized electronic circuit by securing and connecting a large scale integrated circuit semiconductor die within and to a thin and flat printed circuit board carrying interconnected other components of said electronic circuit comprising the sequence of
- a. attaching said semiconductor die within a relatively flat die carrier that is larger than the die and structured to receive the die within a recess formed by a walled portion of the carrier extending along the edges thereof, said carrier being provided with an outwardly extending flange near its bottom edge;
- and then
- b. placing said die carrier containing said die into a hole of said printed circuit board which has been preformed and sized to receive said die carrier substantially entirely therewithin, and bonding said flange to a bottom surface of said board adjacent to said hold;
- then
- c. electrically interconnecting terminal pads of said die to corresponding printed circuit terminal pads on a top surface of said board adjacent to said hole;
- and then
- d. covering completely said die, the exposed wall portion and recess surface of said carrier and portions of said board adjacently surrounding said hole including terminal pads of both said die and said board with hardcuring liquid encapsulation material.
A flat and thin unitary electronic assembly for use in electronically controlled apparatus comprising in combination:
- a. a flat and thin printed circuit substrate having conductive paths and connected components on at least one major surface thereof and originally formed with a transverse opening with connection pads of at least some of said paths spaced around said opening;
- b. a die carrier sized and shaped to fit substantially entirely within and occupy said substrate opening and permanently secured therein, said carrier having an peripheral wall portion forming a shallow recess in a major surface of said carrier, said carrier including flange means extending from the bottom edge thereof and means bonding said flange means to the adjacent major surface of said substrate;
- c. a semiconductor die permanently attached to said carrier entirely within said recess and having a flat top surface processed to define a microelectronic circuit with electrical terminal pads, a flat bottom surface generally parallel to said top surface and a transverse thickness much smaller than the length or width of its top surface;
- d. electrical connection means for directly interconnecting said terminal pads of said die to predetermined corresponding connection pads on said substrate and
- e. cured encapsulation means enveloping said die, the exposed recess portions of said die carrier and said electrical connection means.
Dependencies are inferred from the claim text.