Loading patent…
AssigneeThermalloy Incorporated
InventorsSteven F. Edwards, James A. Johnson, William D. Jordan, James D. Pritchett
Estimating the term…
Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.
Unitary heat sink apparatus comprising a substantially U-shaped body of thermally conductive material, one leg of said U-shaped body providing a relatively broad area flat surface adapted to mate with the thermal transfer plate of a semiconductor encapsulation device and including indexing means protruding from said flat surface of said one leg for mating with indexing means provided in said encapsulation device, the opposite leg of said U-shaped body providing means for urging the thermal transfer plate of said encapsulation device into intimate contact with said one leg, and the base of said U-shaped body providing spring means for urging said opposite leg of said U-shaped body toward said one leg of said U-shaped body, said base further having an aperture therein for permitting the leads extending from said encapsulation device to extend therethrough.
Apparatus as defined in claim 2 wherein said indexing means on said flat surface is a raised dimple adapted to mate with a hole in the heat transfer plate of said encapsulation device.
The combination comprising:
Dependencies are inferred from the claim text.