US 4,054,824 A · Wire bonding unit using infra-red ray detector

Abstract

A wire bonding system is disclosed wherein a patterned substrate to be bonded is composed of at least two materials having different emission rates of infra-red rays, and a point to be bonded on the patterned substrate is positioned so as to coincide with a predetermined reference position. The present invention includes a servo-mechanism, which moves the patterned substrate, and a detecting element which scans the surface of the patterned substrate in a linear direction and detects the infra-red rays radiated therefrom. A pattern figure is obtained by using the differences in the emission rate of the infra-red rays caused by the material of the pattern. A signal which indicates the pattern figure is compared with another signal which indicates the reference position, and a control signal, corresponding to the difference between the point on the pattern to be bonded and the reference position, is obtained. The servo-mechanism is controlled by said control signal so that the point to be bonded is placed at the reference position.

Claims11

Dependent claims

Wire bonding unit for positioning a work having a pattern thereon composed of at least two materials having different emission rates of infra-red rays so that a position to be bonded with a wire on said pattern coincides with a predetermined reference position, said wire bonding unit comprising:

a servo-mechanism means for relatively moving said work with respect to said reference position;
an infra-red ray detecting means for detecting the infra-red rays radiated from said pattern by scanning the surface of said work in a first direction;
a pattern signal generating means for generating a signal corresponding to a portion of said scanned pattern obtained in accordance with the difference in the emission rates of infra-red rays from said materials, and;
means for generating a reference signal indicating when said detecting scans across said predetermined reference position;
a controlling means for comparing said pattern signal with said reference signal and producing a control signal corresponding to the distance between said position to be bonded and said predetermined reference position, and for controlling said servo-mechanism by said control signal so that said position to be bonded coincides with said predetermined reference position.

2 more elements

Dependencies are inferred from the claim text.

Wire bonding unit using infra-red ray detector

Life of this patent

Wire bonding unit using infra-red ray detector

Life of this patent

Abstract

Claims11