Contact carrying spring member

A contact-carrying spring member to be positioned in an insulating housing for providing an electrical path between a integrated circuit package to a printed circuit board or the like, which comprises, a length of conductive material formed into a generally C-shaped configuration and having an upper and lower flexible beams connected to each other by an arcuate bight with the full extent of the upper beam overlying the lower beam, the lower beam being horizontal with a downwardly projecting jog positioned intermediate the ends, said jog having on its outside surface a contact adapted to engage a circuit on a printed circuit board, the upper beam comprising first and second horizontal sections, said first section being displaced upwardly from said second and integrally joined thereto by a vertical section, said first section having a free end thereon, a contact positioned on the outside surface of the first section adapted to engage a circuit pad on an integrated circuit package which may be positioned on the housing, further, said free end on the first section being rounded so that as a package is loaded into the housing, said upper beam may be deflected downwardly with the rounded free end sliding down a vertical sidewall of the housing.