Housing and lead structure for a series connected semiconductor rectifier arrangement

A semiconductor rectifier arrangement comprising in combination:

• a metal base plate;
• a layer of electrically insulating but thermally conductive material fastened to the upper surface of said base plate;
• a pair of electrical contact layers fastened to the surface of said layer of insulating material and electrically isolated from one another;
• a pair of semiconductor rectifier devices, each having at least one pn junction and a connecting contact on each of its two opposite major surfaces, each of said semiconductor devices being mounted on and having one of its said connecting contacts electrically connected to a respective one of said electrical contact layers;
• conductive means for electrically connecting one connecting contact on one of said semiconductor rectifier devices to one connecting contact on the other of said semiconductor rectifier devices to connect said semiconductor devices in a series circuit;
• first, second and third current conducting terminals connected to the input of said series circuit, to the output of said series circuit, and to said conductive means, respectively, said first, second and third current conducting terminals being arranged in a row with each of the two outer current conducting terminals of said row being electrically conductively connected to one of said electrical contact layers;
• and
• a plastic housing connected to said base plate and in which said series circuit, including its connecting parts is disposed.