Black-body wafer support fixture for exposure of photoresist

A fixture suitable for supporting a photoresist coated wafer during back exposure of said photoresist to photoresist-activating radiation which passes through said wafer prior to entering said photoresist for exposing said photoresist in a pattern determined by the shadowing characteristics of said wafer and any other material through which said radiation passes prior to entering said photoresist, said wafer having first and second sides, said first side including a utilizable area having said photoresist coating thereon, said wafer including at least a portion which is transmissive of photoresist activating radiation, said fixture comprising:

• a black body having a cavity therein and an upper surface;
• said cavity having an opening thereto and a wall defining said cavity, said opening being in said upper surface, said upper surface adapted to face a source of said photoresist-activating radiation during exposure of said photoresist,
• support means for supporting said wafer with said first side of said wafer down for back exposure of said photoresist by photoresist activating radiation which passes through said transmissive portion of said wafer prior to entering said photoresist;
• said opening subtending at least a significant portion of said wafer when said wafer is supported by said support means with said first side down, and;
• said support means and said wall of said cavity spaced at least a predetermined distance from said photoresist disposed on said utilizable area of said wafer when said wafer is supported by said support means with said first side of said wafer down, said predetermined distance sufficient to assure that any photoresist-activating radiation which passes through said photoresist coated wafer during normal exposure of said photoresist is not reflected back into said photoresist by said support means or said wall of said cavity in photoresist-activating quantities.

A fixture suitable for supporting a photoresist coated wafer during back exposure of said photoresist to photoresist-activating radiation which passes through said wafer prior to entering said photoresist for exposing said photoresist in a pattern determined by the shadowing characteristics of said wafer and any other material through which said radiation passes prior to entering said photoresist, said wafer having first and second sides, said first side including a utilizable area having said photoresist coating thereon, said photoresist and wafer including at least a portion which is at least partially transmissive of photoresist-activating radiation, said fixture comprising:

• a black body having a cavity therein and an upper surface;
• said cavity having an opening thereto and a wall defining said cavity, said opening being in said upper surface, said upper surface adapted to face a source of said photoresist-activating radiation during exposure of said photoresist;
• said black body being opaque and substantially non-reflective to said photoresist-activating radiation;
• said black body including support means surrounding said opening for supporting said wafer in alignment with said opening with said first side of said wafer down for back exposure of said photoresist by photoresist-activating radiation which passes through said transmissive portion of said wafer prior to entering said photoresist;
• said opening subtending at least said utilizable area of said wafer when said wafer is supported by said support means with said first side down, and;
• said support means and said wall of said cavity spaced at least a predetermined distance from said photoresist disposed on said utilizable area of said wafer when said wafer is supported by said support means with said first side of said wafer down, said predetermined distance being sufficient to assure that any photoresist-activating radiation which passes through said photoresist coated wafer during normal exposure of said photoresist is not reflected back into said photoresist by said support means or said wall of said cavity in photoresist-activating quantities.

A method of exposing a coating of photoresist on a wafer, said wafer having first and second sides, said first side including a utilizable area having said photoresist coating thereon, said wafer including at least a portion which is transmissive of photoresist-activating radiation, said method comprising:

• disposing said wafer on support means with said first side of said wafer away from a source of photoresist-activating radiation for back exposure of said photoresist is photoresist-activating radiation which passes through said transmissive portion of said wafer prior to entering said photoresist for exposing said photoresist in a pattern determined by the shadowing characteristics of said wafer and any other material through which said radiation passes prior to entering said photoresist, said wafer being disposed with that portion of the photoresist coating which is disposed on the utilizable area of said wafer out of contact with and spaced at least a predetermined distance from all solid objects other than said wafer, said predetermined distance sufficient to assure that any photoresist-activating radiation which passes through said photoresist coated wafer during normal exposure of said photoresist is not reflected back into said photoresist by said solid objects in photoresist-activating quantities;
• providing shielding means for preventing an exposure-producing quantity of radiation from entering said photoresist coating except from said wafer;
• and
• directing photoresist-activating radiation from said source of radiation through said wafer into said photoresist to expose said photoresist in accordance with the shadowing characteristics of the material between said radiation source and said photoresist.