Interconnected leadless package receptacle

A chip carrier receptacle capable of being coupled to a second chip carrier receptacle comprising:

• a molded plastic receptacle body having a central region for receiving a chip carrier assembly, and a plurality of pockets for receiving spring contact members;
• a plurality of spring contact members, each of said spring contact members being pressed into one of said pockets and extending through said body so as to provide a substantially straight elongated package lead, each of said spring contact members having (i) an integral cantilevered member, said cantilevered member having a projection with at least one component for engaging a conductive area on the bottom of said chip carrier assembly, said cantilevered member making an acute angle with respect to said conductive area such that when said chip carrier assembly is disposed in said receptacle, the end of each cantilevered member slides across said conductive area and makes a point contact therewith, and (ii) an upright, elongated arm member, said arm member being a substantially vertical arm member disposed on each said spring contact member so as to be engaged by an associated lead extending downward from said second receptacle, said arm member further having a flap member for engaging an associated lead of said second receptacle;
• means on said receptacle body for snapping over the edge of and retaining a chip carrier assembly;
• and
• means on said receptacle body for coupling said receptacle to said second receptacle.

A chip carrier receptacle comprised of:

• a nonconductive receptacle body having a means for receiving a chip carrier assembly and having a plurality of pockets formed therein;
• a plurality of spring contact members, each of said contact members being pressed into one of said pockets and extending through said body so as to provide a substantially straight, elongated package lead, each of said spring contact members further having (i) a shaped integral cantilevered member, each said cantilevered member having a projection with at least one component for engaging said conductive area on said chip carrier assembly, said cantilevered member making an acute angle with respect to said conductive area such that when said chip carrier assembly is disposed in said receptacle, the end of each said cantilevered member slides across said conductive area and makes a point contact therewith, and (ii) an upright, elongated arm member, said arm member being a substantially vertical arm member disposed on each said spring contact member so as to be engaged by an associated lead extending downward from a second receptacle, said arm member further having a flap member for engaging an associated lead of said second receptacle;
• a chip carrier assembly having a plurality of conductive areas on its bottom surface, and means for releasably retaining said chip carrier assembly in said receptacle whereby each said spring contact members is in forcible point contact with a respective one of said conductive areas;
• and
• means on said receptacle body for coupling said receptacle to said second receptacle.

Upper and lower chip carrier receptacles interconnected so as to form a discrete, leadless package system comprising:

• upper and lower nonconductive bodies, each said body having means for receiving a chip carrier assembly;
• and
• upper and lower spring contact members in each said respective bodies, each of said contact members having a portion thereof forming a lead extending downward from each said body each of said spring contact members further having (i) a shaped cantilevered member disposed in said respective receptacles so as to forcibly slide across a conductive area on the bottom surface of each said respective chip carrier assembly upon insertion thereof, and make a point contact therewith, said cantilevered member making an acute angle with respect to said conductive area such that when said chip carrier assembly is disposed in said receptacle, the end of said cantilevered member slides across said conductive area and makes a point contact therewith, and (ii) an upright arm member, each said arm member disposed in said lower receptacle so as to be engaged by said leads of said upper receptacle;
• and
• upper and lower associated chip carrier assemblies, each assembly having a plurality of conductive areas on its bottom surface, and means for releasably retaining each said chip carrier assembly in said respective receptacles whereby each said spring contact member is in forcible contact with a respective one of said conductive areas.