Method for coating bonding tools and product
AssigneeTribotech
InventorDenis K. Gilding
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Abstract
A method for the electrodeposition of osmium, ruthenium or their alloys from alkali metal salts of the same in a nonaqueous solvent capable of permitting dissociation of the salt and having low surface tension (e.g., methanol or dimethyl formamide) or mixtures. A silicone layer chemically bonded to the surface of said electrodeposited layer. Also, a bonding tool having a tip coated by either of the above electrodeposited layer or the silicone layer, or both.
Claims30
A method for the electrodeposition of the hard metal osmium, or alloys thereof comprising the steps of forming an electrolyte solution consisting essentially of a dissociated alkali metal salt of a complex of osmium as the anion in a nonaqueous organic solvent capable of dissolving said salt in ionized form and electrolytically depositing the hard metal from the solution onto a plating substrate comprising the cathode, said organic solvent consisting essentially of a major portion of aprotic solvent and a minor portion of lower alcohol.
An electrolytic solution for depositing the hard metal osmium onto a substrate, said solution consisting essentially of a dissociated alkali metal salt of an oxide complex of osmium in a nonaqueous organic solvent consisting essentially of a major portion of aprotic solvent and a minor portion of a lower alcohol.
In a microstructural bonding tool for holding a bonding wire against a surface to which the wire is to be bonded during application of energy thereto, which tool comprises an elongate tool body having wire guide means and a bonding surface at the end thereof, a layer on said tool of electrodeposited hard metal selected from the group consisting of osmium, ruthenium or alloys of the same, said layer being characterized by a grain size less than 15 microinches.
Dependencies are inferred from the claim text.