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US 3,946,126 AGranted
Method of electroless nickel plating
AssigneeRCA Corporation
InventorNathan Feldstein
Life of this patent
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Abstract
A method for the electroless deposition of nickel on a substrate without pretreatment of the substrate, in which the reducing agent is an amine borane compound, the relatively high pH is maintained with NH.sub.4 OH plus a strong alkali, and the complexing agent is pyrophosphate anion.
Claims1
A method of depositing nickel electrolessly on the metallic surfaces only of an assembly comprising a ceramic and conducting portions made of an alloy of molybdenum and manganese, said method comprising:
- treating said assembly with a bath, at 40.degree. C or higher, which contains:
- a nickel salt 10 - 50 g/L a pyrophosphate 10 - 100 g/L ammonium hydroxide 5 - 40 cc/L (58% by wt. solution) dimethylamine borane 0.1 - 3 g/L.
Dependencies are inferred from the claim text.