Hold down device for use in electronic systems employing integrated circuits
AssigneeBurroughs Corporation
InventorsPeter P. Klein, Robert E. Braun
Life of this patent
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Abstract
A hold down device is described for applying a high clamping force to a "leadless" integrated circuit package installed in a suitable connector. Use of the device results in reliable electrical connections between the package circuit leads and the connector contact elements; and reliable thermal connections between the package carrier and a cooling frame provided to dissipate the heat generated by the integrated circuits. The hold down device has added system utility in the clamping of an interconnect cable assembly adapted to plug into the aforementioned connector in lieu of the integrated circuit package.
Claims8
A hold down device for use in a system which includes at least one electronic component installed in a connector and which incorporates a cooling frame comprising:
- a plurality of bracket means mounted adjacent said cooling frame for supporting a plurality of spaced-apart parallel rods,
- said connector being located in the space between an adjacent pair of rods,
- a spring-like member formed in a shallow, upright, truncated V configuration, one end of said spring-like member being centrally notched in a U-shaped configuration such that the extremities of the legs of the U are pivotally wrapped around one of said pair of spaced-apart rods, the opposite end of said member being configured in a manner to latch on the other of said pair of rods in opposition to the force of said spring-like member exerted on said electronic component,
- said spring-like member being disposed in substantial alignment with said electronic component whereby the latching of said member applies a force to said component of sufficient magnitude to insure electrical continuity between said component and connector.
Dependencies are inferred from the claim text.