Cooling arrangement for flat semiconductor components

A cooling arrangement for a plurality of flat semiconductor components such as disc-type thyristors, made up of a plurality of cooling arrangements each comprising two cooling elements of thermally highly conductive material with a semiconductor clamped therebetween in good thermal contact, with each cooling element provided with at least one elongated recess into which is inserted in good thermal contact a portion of a heat pipe closed on both sides, lined on the inside with a wick and partially filled with an evaporable working fluid with cooling fins attached with good thermal contact on the protruding portion of the heat pipes transversely to their axes, comprising a plurality of individual cooling arrangements arranged in a column-like cooling stack with the individual semiconductor components axially aligned with each other and the axes of the heat pipes of the cooling element placed one on top of the other and arranged such that they are angularly displaced with respect to each other about the axis of the stack in helical fashion with the helix so formed having a first direction of rotation, and a blower forcing air through said column, said blower having a direction or rotation, as viewed in the flow direction of the coolant, which is opposite to the direction of rotation of said helical arrangement of heat pipes.