Electronic circuit package and method of brazing
AssigneeBurroughs Corporation
InventorRobert Spitler Morse
Life of this patent
Estimating the term…
Abstract
An electronic package assembly having a plurality of gold-plated lead pins solderably secured within a corresponding array of pre-metalized, cylindrical-shaped holes disposed in a ceramic substrate of the package. The interior surfaces defining the holes are pre-metalized with a layer of palladium-silver followed by a layer of gold. The pins are then brazed to the metalized hole interiors with a gold germanium filler metal which has been screen printed on the upper surface of the substrate in ring configurations outlining the pin receiving holes.
Claims7
A method of affixing gold-plated electrical lead pins within pin receiving holes disposed in a ceramic layer of an electronic package assembly comprising the steps of:
- depositing palladium-silver on the interior surfaces defining the holes;
- depositing gold on said palladium-silver;
- positioning a plurality of gold-plated pins within the holes;
- and
- brazing the gold-plated pins within the holes with a gold-germanium solder.
In the art of manufacturing electronic device packages comprising a ceramic layer having a plurality of electrical lead pin receiving holes extending therethrough, the method of affixing gold-plated lead pins within the ceramic layer, comprising the steps of:
- interiorly plating each of the holes with palladium-silver;
- interiorly plating each of the palladium-silver lined holes with gold;
- depositing a gold germanium solder paste having flow characteristics when heated, on one surface of the layer, and being positioned to flow into each of the holes when heated;
- positioning a plurality of gold-plated pins within the holes;
- and
- heating at least the area surrounding the holes including said solder paste causing the brazing of the gold-plated pins to the gold plating on the holes with said solder paste.
In the art of manufacturing electronic device packages comprising a ceramic layer having a plurality of electrical lead pin receiving holes extending therethrough, the method of affixing gold-plated lead pins within the ceramic layer, comprising the steps of:
- interiorly metalizing each of the holes with palladium-silver;
- interiorly metalizing each of the palladium-silver lined holes with gold;
- screen printing a gold germanium solder paste in ring shape configurations on one surface of said layer, each configuration of solder paste contiguous to and bordering the periphery of each of the holes;
- positioning a plurality of gold-plated pins within respective holes and to contact said solder paste;
- and
- heating at least the area surrounding the holes in an inert atmosphere of nitrogen causing the brazing of the pins to said gold disposed on said palladium-silver lined holes with said solder paste.
In the art of manufacturing electronic device packages comprising a ceramic layer, the method of solderably joining a discrete object to the ceramic layer, comprising the steps of:
- metalizing palladium-silver on an area of a ceramic layer where a joining is to occur;
- metalizing the palladium-silver area with gold;
- gold plating a discrete object in an area to be joined to the ceramic layer;
- disposing said gold-plated area of the discrete object in proximity of said metalized area of the ceramic layer for joining to occur by brazing;
- and
- brazing the gold on the discrete object to the gold on the ceramic layer, with a gold-geranium solder.
An electronic device package comprising:
- a ceramic layer having opposing surfaces with a plurality of holes communicating with said surfaces;
- an electronic device mounted on one of said surfaces of said layer;
- an array of electrical leads overlying said one of said surfaces of said layer, one end of each lead communicating with a respective hole and the other end of each lead electrically interconnected to said electronic device;
- a plurality of electrical lead pins, each pin being disposed in one of said holes;
- and
- a metallurgical joint integrally securing each of said pins to the ceramic layer, said joint comprising:
- a palladium-silver layer metalized on the surfaces defining said holes;
- a gold layer metalized on said palladium-silver layer;
- a gold layer plated on said pins;
- and a brazed joint joining both of said gold layers, said brazed joint formed of a gold-germanium filler metal.
An electronic device package comprising:
- a ceramic layer having opposing surfaces with a plurality of holes communicating said surfaces;
- an electronic device mounted on one of said surfaces of said layer;
- an array of electrical leads overlying said one of said surfaces of said layer, one end of each lead communicating with a respective hole and the other end of each lead electrically interconnected to said electronic device;
- a plurality of electrical lead pins, each pin being disposed in one of said holes;
- and
- a metallurgical joint integrally securing each of said pins to the ceramic layer, said joint comprising:
- 1. a metal layer metalized on the surfaces defining said holes;
- 2. a gold layer metalized on said metal layer;
- 3. a gold layer plated on said pins;
- and
- 4. a brazed joint solderably joining both of said gold layers, said brazed joint formed of a gold germanium filler metal.
Dependencies are inferred from the claim text.