Mounting for locking disc shaped semiconductor element in a housing

In a disc-shaped semiconductor arrangement including:

• an annular ceramic housing having a hollow cylindrical interior and having an internal flange adjacent one end face thereof;
• first and second contacting discs having identical diqmeters;
• a semiconductor element interposed between said contacting discs and including a support disc disposed in the housing to be in contact with said first contacting disc, and having a diameter equal to that of said contacting discs, and a disc-shaped semiconductor body fastened via one of its end surfaces to the support disc and having at least one contact electrode fastened to the other of its end surfaces to be in contact with said second contacting disc;
• and an electrically insulating centering ring having an inner diameter matching the diameter of said support disc and said contacting discs and provided with a passage for a connecting lead, said centering ring being disposed to center the contacting discs and the semiconductor element in the housing, the improvement wherein said arrangement further comprises:
• a first sheet metal supporting ring having its inner edge soldered to the perimeter of said first contacting disc and bearing against said internal flange of said housing, said first ring thereby supporting the unit formed by said contacting discs and said semiconductor element and one end of said centering ring resting on said first ring;
• a second sheet metal supporting ring having its inner edge soldered to the perimeter of said second contacting disc and having a tooth-shaped outer edge, the outer diameter of said second ring being greater than the interior diameter of said housing and said second ring being press-fitted into said housing in a manner to cause said second contacting disc to be pressed against said semiconductor body and to be supported by the interior wall surface of said housing;
• and
• a mass of elastic cast material filling said housing interior for connecting the unit formed by said contacting discs and said semiconductor element to said housing.