Back to results
US 3,940,047 AGranted
Bonding apparatus utilizing pivotally mounted bonding arm
AssigneeUnitek Corporation
InventorsJoseph L. Laub, David W. Steinmeier, II
Life of this patent
Estimating the term…
Abstract
Apparatus for controlling the operation of a pivoted member. A pivoted arm such as provided in an apparatus for bonding leads in electronic components is controlled by means of a torque motor during bonding and non-bonding intervals to provide control of forces exerted by the pivoted member during the bonding interval and forces exerted on the pivoted member during non-bonding intervals. Motion cams to complement the operation of the torque motor may also be utilized.
Claims9
In a bonding apparatus, the improvement comprising
- a bonding arm having a bonding tool attached at one end thereof;
- electromechanical means operatively linked to the bonding arm for applying a variable amount of force to the bonding arm, the amount of force applied being proportional to the electrical energy supplied to the electromechanical means;
- input means electrically connected to the electromechanical means for controlling the amount of electrical energy to be supplied to the electromechanical means, the input means comprising a plurality of adjustable energizing electric current sources selectively connectable to the electromechanical means, the plurality of sources including a first source for controlling the amount of force applied to the bonding arm by the electromechanical means when the bonding tool is in contact with a bonding location.
Dependencies are inferred from the claim text.