Ultrasonic thermal compression beam lead, flip chip bonder

A bonding apparatus for use in manufacture of semiconductors for bonding electrical leads of beam lead devices and flip chip devices to mating conductive surfaces on a substrate and for bonding electrical leads to contact pads on a semiconductor device comprising:

• a bonding tool having bonding surface disposed around its periphery;
• a tool holder;
• slidable mounting means for mounting said tool and tool holder on a gimbal;
• a gimbal having a fixed outer frame, a middle frame pivoting on one axis and an inner frame pivoting on the other axis;
• a vertical shaft pivotally connected to each of said pivoting gimbal frames;
• a horizontal shaft pivotally connected to each of said vertical shafts;
• an adjustable pivot block for each of said horizontal shafts through which said horizontal shafts pass to adjust the pivot points of each of said horizontal shafts;
• a cam follower shaft pivotally attached to each of said horizontal shafts;
• a cam follower mounted on each of said cam follower shafts;
• a plurality of cams, some of which are in contact with said cam followers, and at least two of which are ninety degrees out of phase with one another;
• a cam shaft on which said cams are mounted;
• a motor driving said cam shaft;
• a plurality of cams controlling said motor;
• a movable mounting means for said gimbal, said cam shaft, said cam motor and said means for moving said pivot block;
• a drive means including a motor for driving said movable mounting means;
• a housing for said movable mounting means and said drive means;
• said drive means moving said bonding tool into and out of a work area wherein are placed semiconductors in the manufacturing process;
• illuminated optical means for an operator to view and align said bonding tool to said semiconductors;
• a source of bonding energy for supplying bonding energy to the bonding surfaces of said bonding tool;
• means to control said source of bonding energy such that it is applied only when said apparatus is bonding.

A bonding apparatus for bonding electrical leads of a semiconductor device to a pattern of conductors on a carrier comprising:

• a housing;
• a tool holder mounted on said housing for movement relative thereto;
• a bonding tool attached to one end of the tool holder in radial alignment therewith such that the longitudinal axis of said bonding tool is approximately perpendicular to the longitudinal axis of said tool holder;
• a plurality of bonding surfaces on said bonding tool for engaging the electrical leads of a semiconductor device;
• wobble drive means mounted on said housing engaging said tool holder remote from said plurality of bonding surfaces for moving said tool on a predetermined, adjustable tilted axis to cause the bonding surface of said bonding tool to engage and bond sequentially the electrical leads of a semiconductor device in a predetermined, adjustable path around the periphery of the semiconductor device;
• a source of bonding energy for said bonding tool comprising an ultrasonic generator producing a range of frequencies including a center frequency;
• and
• an ultrasonic transducer mounted on said tool holder in a radial alignment with said bonding tool, the longitudinal axis of said transducer being approximately perpendicular to the longitudinal axis of said bonding tool for transmitting ultrasonic energy from said ultrasonic generator to said bonding tool whereby said transducer wobbles along with said bonding tool, said generator further including means for modulating the wave form of the center frequency of said ultrasonic generator in a predetermined manner such that said generator will sweep through resonance a determined number of times during the time period in which the bonding surface of said tool is engaging an electrical lead of a semiconductor device.

The bonding apparatus for bonding electrical leads of a semiconductor device to a pattern of conductors on a carrier comprising:

• a housing;
• a tool holder mounted on said housing for movement relative thereto;
• a bonding tool attached to one end of the tool holder in a radial alignment therewith such that the longitudinal axis of said bonding tool is approximately perpendicular to the longitudinal axis of said tool holder;
• a source of bonding energy for said bonding tool;
• a plurality of said bonding surfaces on said bonding tool for engaging the electrical leads of a semiconductor device;
• wobble drive means mounted on said housing engaging said tool holder remot from said plurality of bonding surfaces for moving said tool on a predetermined, adjustable tilted axis to cause the bonding surface of said bonding tool to engage and bond sequentially the electrical leads of a semiconductor device, said wobble drive means comprising:
• a gimbal mechanism having a pivotal frame;
• means to cause an adjustable pivotal movement of said gimbal mechanism;
• a variable speed motor to drive and control said means to cause the adjustable pivotal movement of said gimbal mechanism;
• a cam shaft driven by said wobble drive variable speed motor;
• a plurality of interchangeable cams mounted on said cam shaft for defining and controlling the pivotal movements of said gimbal mechanism;
• a plurality of cams mounted on said cam shaft for synchronizing the pivotal movement of said gimbal mechanism and the dispensing of bonding energy during the wobbling movement of said bonding tool;
• and wherein said tool holder is mounted on a ball slide mounted on said pivotal frame of said gimbal mechanism.