Method of and bath for the plating of aluminum or an aluminum alloy on a metallic substrate
AssigneeMetallgesellschaft Aktiengesellschaft
InventorWolfgang Thiele
Life of this patent
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Abstract
Aluminum or an aluminum alloy is plated on a metallic substrate from a bath of molten aluminum or aluminum alloy containing 0.005 to 1.0% (preferably 0.01 to 0.5%) strontium and/or 0.01 to 5.0% antimony. The metal substrate is preferably iron, steel, or a noniron metal such as copper, titanium, nickel, cobalt, chromium, tantalum, tungsten, vanadium or zirconium. The bath may also contain 1.0 to 15.0% by weight silicon and 0.005 to 1.0% beryllium.
Claims7
A hot dip method of producing an aluminum-alloy coating comprising the steps of immersing a metallic substrate into a bath of molten aluminum-alloy consisting essentially of 0.005 to 1.0% by weight of strontium and/or 0.01 to 5.0% by weight antimony balance aluminum and metallic impurities due to the producing process, for a period sufficient to deposit an aluminum-alloy coating on said substrate.
A method of producing an aluminum or aluminum-alloy coating comprising the steps of immersing a metallic substrate into a bath of molten aluminum or aluminum-alloy consisting essentially of:
- 0.005% to 1.0% Sr by weight, and/or
- 0.01% to 5.0% Sb
- up to 15% Si
- up to 1% Be;
- and
- balance aluminum,
- for a period sufficient to deposit an aluminum or aluminum-alloy coating on said substrate.
Dependencies are inferred from the claim text.