Process for preparing a metallized resin film for condenser element
AssigneeOike & Co., Ltd.
InventorsHiroshi Narui, Terumi Shinohara
Life of this patent
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Abstract
A process for providing a margin in a metallized resin film for a condenser element which is characterized by providing on a dielectric resinous layer a water-soluble coating layer having a pattern corresponding to a margin pattern, providing a metal deposition layer on the resinous layer including a coated part and a non-coated part and removing the water-soluble coating layer and the metal deposition layer thereon by washing with water. According to the process, a metallized resin film having an arbitrary margin pattern and a superior electrical property can be readily obtained, with completely eliminating any complexity of the procedure and disadvantage in conventional processes for providing a margin.
Claims18
In a process for producing a metallized resin film for a condenser element comprising at least one di-electric resinous layer and at least one metal deposition layer, the improvement which comprises forming on said resinous layer a margin wherein the metal deposition layer is not present by the steps comprising
- 1. providing a water-soluble coating layer by applying a water-soluble paint to at least one side of the dielectric resinous layer in the portion of the resinous layer corresponding to the pattern of margin,
- 2. providing a metal deposition layer on the dielectric resinous layer partially coated with the water-soluble coating layer, said metal deposition layer being applied by means of vacuum metallizing procedures, and
- 3. removing the water-soluble coating layer and the metal deposition layer thereon by dissolving away the water-soluble coating layer with water.
Dependencies are inferred from the claim text.