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US 3,934,056 AGranted
Resin compositions of high adhesivity comprising E/VA copolymer, chlorinated or chlorosulfonated polyethylene, an unsaturated acid and a peroxy compound
AssigneeShowa Denko K.K.
InventorsMasaharu Yoshida, Shigenobu Ishihara, Tsuyoshi Takahashi, Hiroki Imakura
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Abstract
Resin compositions of high adhesivity which comprise (A) ethylene-vinylacetate copolymer or mixture of said copolymer with polyethylene, (B) chlorinated or chlorosulfonated polyethylene, (C) unsaturated carboxylic acids maintaining solid at room temperature and (D) organic peroxides or these components blended with phenolic compounds and/or acid-acceptors.
Claims28
Resin compositions of high adhesivity comprising (A) 100 parts by weight of ethylene-vinyl acetate copolymer containing 1 to 40% by weight of vinyl acetate or said copolymer mixed with polyethylene;
- (B) 1 to 100 parts by weight of chlorinated or chlorosulfonated polyethylene;
- (C) 0.05 to 100 parts by weight of unsaturated carboxylic acids that are solid at room temperature;
- and (D) 0.005 to 10.0 parts by weight of organic peroxides.
Dependencies are inferred from the claim text.