Melamine, formaldehyde, thiourea and diol ether thermosetting resin and method of preparing the same
AssigneeSuddeutsche Kalkstickstoff-Werke Aktiengesellschaft
InventorsHorst Michaud, Josef Seeholzer, Ludwig Pentzel, Josefa Mangs
Life of this patent
Estimating the term…
Abstract
A thermosetting resin useful for attaching decorative paper facings to chipboard and like cellulosic panels is prepared by condensation of melamine with thiourea, formaldehyde, and a diol ether, up to one half by weight of the melamine being capable of being replaced by urea without seriously effecting the quality of the resin.
Claims3
A thermosetting resin composition capable of bonding paper to clipboard within two minutes at a temperature of 160.degree.C and a pressure of 20 kg/cm.sup.2 when mixed with 0.05% formamidinesulfinic acid, the resulting bond between said paper and said clipboard being stable at said temperature at atmospheric pressure, said resin composition essentially consisting of a liquid condensation mixture obtained by heating melamine, formaldehyde, thiourea, and a diol ether at 80.degree. - 100.degree.C and pH 8.6 - 8.8 until the condensation mixture first becomes turbid at 20.degree.C when diluted with water to a solids content of 10% - 50%, said diol ether being of the formula HO--(CH.sub.2).sub.m --O--(CH.sub.2).sub.m --OH, wherein m is 2 or 3, the amount of said thiourea being 0.08 to 0.12 mole, the amount of said formaldehyde being 2 moles, and the amount of said diol ether being between 0.06 and 0.13 mole, said amounts being per mole of melamine.
Dependencies are inferred from the claim text.