Semiconductor devices and methods of manufacturing semiconductor devices

An electronic device, comprising:

• a first substrate comprising an inner side and an outer side, a first dielectric structure, and a first conductive structure;
• a second substrate over the first substrate and comprising an inner side and an outer side, a second dielectric structure, and a second conductive structure;
• a first array of antenna components between the first substrate and the second substrate and coupled to the second conductive structure;
• a first encapsulant between the inner side of the first substrate and the inner side of the second substrate;
• and
• an internal interconnect coupled to the first conductive structure and the second conductive structure, wherein the internal interconnect is in the first encapsulant;
• wherein the first array of antenna components comprises a first antenna component comprising a first component dielectric structure and a first component interconnect coupled to the second conductive structure;
• and
• wherein the first encapsulant covers a lateral side of the first antenna component.

A method to manufacture an electronic device, comprising:

• providing a first substrate comprising an inner side and an outer side, a first dielectric structure, and a first conductive structure;
• providing a first antenna component on the inner side of the first substrate and coupled to the first conductive structure;
• providing an internal interconnect on the inner side of the first substrate and coupled to the first conductive structure;
• providing a second substrate comprising an inner side and an outer side, a second dielectric structure, and a second conductive structure, wherein the first substrate is over the second substrate and wherein the internal interconnect is coupled to the second conductive structure;
• and
• providing a first encapsulant between the inner side of the first substrate and the inner side of the second substrate and covering a lateral side of the first antenna component, wherein the internal interconnect is in the first encapsulant;
• wherein the first antenna component comprises a first component dielectric structure and a first component interconnect coupled to the first conductive structure.