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US 2026/0314456 A1Published application
Circuit board, and semiconductor package comprising same
AssigneeLG Innotek Co., Ltd.
InventorsYong Ho SON, Moo Seong KIM, Jung Eun HAN
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Abstract
Disclosed in an embodiment of the present invention is a circuit board comprising: a first insulating layer; a first circuit pattern layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and the first circuit pattern layer, and including a cavity; a second circuit pattern layer disposed on the second insulating layer; and a connection layer passing through the second insulating layer and disposed along the edge of the cavity.
Claims20
A circuit board comprising:
- a first insulating layer;
- a first circuit pattern layer disposed in the first insulating layer;
- a second insulating layer disposed on the first insulating layer and the first circuit pattern layer and including a cavity;
- a second circuit pattern layer disposed in the second insulating layer;
- and
- a connection layer passing through the second insulating layer and disposed along an edge of the cavity.
3 more elements
A package substrate comprising:
- a circuit board;
- a semiconductor element connected to the circuit board;
- and
- a connection part configured to connect the semiconductor element to the circuit board,
- wherein the circuit board includes:
- a first insulating layer;
- a first circuit pattern layer disposed in the first insulating layer;
- a second insulating layer disposed on the first insulating layer and the first circuit pattern layer and including a cavity;
- a second circuit pattern layer disposed in the second insulating layer;
- and
- a connection layer passing through the second insulating layer and disposed along an edge of the cavity,
- the package substrate further includes a shield layer disposed at an outer side of the second insulating layer, and
- the connection layer is electrically connected to the shield layer.
10 more elements
Dependencies are inferred from the claim text.