Antenna protection on dummy metal fills
AssigneeMicron Technology, Inc.
InventorsHao Chen, Raja Kumar Varma Manthena, Surendranath C. Eruvuru
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AssigneeMicron Technology, Inc.
InventorsHao Chen, Raja Kumar Varma Manthena, Surendranath C. Eruvuru
Estimating the term…
A memory device can include a semiconductor substrate having a plurality of active semiconductor devices. The memory device can include a plurality of metallization layers disposed over the semiconductor substrate, where each of the plurality of metallization layers is separated from adjacent metallization layers by an interlayer dielectric. The memory device also includes a dummy metal fill disposed in a metallization layer. The dummy metal fill can be connected to a discharge path for dissipating a charge build up in the dummy metal fill to minimize antenna effects. In some embodiments, the discharge path can include the semiconductor substrate, which can be an electrical drain. The antenna protected dummy metal fill ensures is configured such that any accumulated charge during the fabrication process is discharged to the electric drain.
A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to:
An apparatus, comprising:
A method, comprising:
Dependencies are inferred from the claim text.