Methods and systems for area selective processing
AssigneeTokyo Electron Limited
InventorKandabara Tapily
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Abstract
A method is provided for processing a substrate. The method includes providing a substrate including a first region and a second region, wherein the first region includes a catalytic surface and the second region includes a non-catalytic surface. A polymer layer is selectively formed over the catalytic surface of the first region. A coating layer is formed over the polymer layer and the second region. The coating layer is planarized to expose the polymer layer. The polymer layer is removed by annealing the substrate.
Claims20
A method for processing a substrate, the method comprising:
- providing a substrate comprising a first region and a second region, wherein the first region comprises a catalytic surface and the second region comprises a non-catalytic surface;
- forming a polymer layer selectively over the catalytic surface of the first region;
- forming a coating layer over the polymer layer and the second region;
- planarizing the coating layer to expose the polymer layer;
- and
- removing the polymer layer by annealing the substrate.
A method for processing a substrate, the method comprising:
- loading a substrate in a process chamber, the substrate comprises a first region comprising a metal surface and a second region comprising a non-catalytic surface;
- forming a catalytic metal cap over the metal surface of the first region;
- depositing a polymer layer selectively over the catalytic metal cap;
- forming a coating layer over the polymer layer and the second region;
- planarizing the coating layer to expose the polymer layer;
- and
- removing the polymer layer by annealing the substrate.
A system for processing a substrate, the system comprising:
- a transfer module configured to maintain vacuum conditions;
- a surface treatment module coupled to the transfer module and configured to apply a surface treatment material to a substrate;
- a metal cap module coupled to the transfer module and configured to form a catalytic metal cap on the substrate;
- a polymer deposition module coupled to the transfer module and configured to selectively deposit a polymer layer on the catalytic metal cap;
- a planarization module coupled to the transfer module and configured to planarize the substrate;
- and
- an annealing module coupled to the transfer module and configured to remove the polymer layer from the substrate.
Dependencies are inferred from the claim text.