Thermal Regulation of High Power Spacecraft Electronics via Encapsulation in Phase Change Material

Abstract

This disclosure relates to a local thermal regulation solution for high-power electronics or printed circuit assemblies for use onboard satellites. Thermal regulation is achieved by immersing electronic components in a dielectric phase change material (PCM) within an encapsulating hermetically sealed enclosure. The dielectric PCM can absorb transient thermal spikes during intermittent high-power operations then release this stored energy during low points in the duty cycle. The released thermal energy can be conducted to the vehicle structure via a mounting interface of the enclosure, whereby it is eventually radiated to deep space by the external vehicle surfaces via blackbody radiation. An integrated expansion relief mechanism, which can include pistons, viscoelastic dampers, membranes, and/or bellows, compensates for volumetric changes during PCM phase transitions, ensuring a homogeneous, pressurized mixture optimized for heat absorption. The PCM can also act as a vibration dampener and radiation shield.

Dependencies are inferred from the claim text.