Cooling module
AssigneeIceotope Group Limited
InventorMustafa KADHIM
Life of this patent
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Abstract
A cooling module for cooling one or more electronic components within the cooling module, comprises: one or more electronic components; and a cooling element configured to cool the one or more electronic components by distributing liquid coolant over the one or more electronic components. The cooling element comprises: a first region configured to receive the liquid coolant from a supply of liquid coolant; a second region comprising a plurality of openings; and a weir between the first and second regions. The first and second regions and the weir are arranged above the one or more electronic components such that liquid coolant in the first region overflows over the weir and onto the plurality of openings, so as to distribute the liquid coolant over the one or more electronic components.
Claims25
A cooling module for cooling one or more electronic components within the cooling module, comprising:
- one or more electronic components;
- and
- a cooling element configured to cool the one or more electronic components by distributing liquid coolant over the one or more electronic components, the cooling element comprising:
- a first region configured to receive the liquid coolant from a supply of liquid coolant;
- a second region comprising a plurality of openings;
- and
- a weir between the first and second regions;
- wherein the first and second regions and the weir are arranged above the one or more electronic components such that liquid coolant in the first region overflows over the weir and onto the plurality of openings, so as to distribute the liquid coolant over the one or more electronic components.
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Dependencies are inferred from the claim text.