Information Handling System Having Mount System with a Blank Module Having an Integrated Air Flow Component

A mount system comprising:

• a plurality of connector receptacles, each of the plurality of connector receptacles being configured to receive a respective memory module, the plurality of connector receptacles being positioned to arrange the respective memory modules in an array;
• and,
• a blank system, the blank system comprising
• a blank module, the module being configured to mount to a connector receptacle of the plurality of connector receptacles;
• and,
• an integrated thermal component mechanically attached to the blank module, the integrated thermal component being positioned to avoid touching a memory module when the memory module is installed in the mount system.

A system comprising:

• a processor;
• a data bus coupled to the processor;
• and
• a mount system coupled to the processor via the data bus, the mount system comprising:
• a plurality of connector receptacles, each of the plurality of connector receptacles being configured to receive a respective memory module, the plurality of connector receptacles being positioned to arrange the respective memory modules in an array;
• and,
• a blank system, the blank system comprising
• a blank module, the module being configured to mount to a connector receptacle of the plurality of connector receptacles;
• and,
• an integrated thermal component mechanically attached to the blank module, the integrated thermal component being positioned to avoid touching a memory module when the memory module is installed in the mount system.