Substrate processing device and substrate processing method
AssigneeUlvac, Inc.
InventorsTeppei Takahashi, Ken Maehira
Life of this patent
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Abstract
A connection part of this substrate-processing device has an opening that connects a second space to a first space. In the substrate-processing device, a space that includes the first space and the second space connected to each other through the opening is a processing space. A static electricity elimination part is configured to generate plasma from a plasma generation gas supplied into a second vacuum tank, and eliminate static electricity from a support part positioned in the first space, by setting the average free path in the processing space for charged particles in the plasma to be shorter than the smallest dimension of the opening in a plane orthogonal to a plane along a direction from the second space toward the first space.
Claims5
A substrate-processing device, comprising:
- a first vacuum container defining a first space that accommodates a static elimination subject;
- a second vacuum container defining a second space;
- a connector connecting the second vacuum container to the first vacuum container;
- and
- a static eliminator that performs static elimination on the static elimination subject located in the first vacuum container, wherein:
- the connector includes an opening thorough which the second space is in communication with the first space;
- a space including the first space and the second space, which are in communication with each other through the opening, is a processing space;
- and
- the static eliminator is configured to perform static elimination on the static elimination subject located in the first vacuum container by generating plasma from a plasma generation gas supplied to the second vacuum container so that charged particles in the plasma in the processing space have a mean free path that is shorter than a smallest dimension of the opening in a plane orthogonal to a plane extending in a direction from the second space toward the first space.
A substrate-processing method, comprising:
- connecting a second space, defined by a second vacuum container, to a first space, defined by a first vacuum container and accommodating a static elimination subject, through an opening in a connector that connects the second vacuum container to the first vacuum container;
- and
- performing static elimination on the static elimination subject located in the first space by generating plasma from a plasma generation gas supplied to the second vacuum container so that charged particles of the plasma in a processing space have a mean free path that is shorter than a smallest dimension of the opening in a plane orthogonal to a plane extending in a direction from the second space toward the first space, the processing space including the first space and the second space in communication with each other through the opening.
Dependencies are inferred from the claim text.