Workpiece support

​ A workpiece support, comprising:

• a base including a first surface and a second surface opposite the first surface, the base configured to support a semiconductor wafer having a lithography frame region for circuit patterning, the lithography frame region having a first dimension and a second dimension;=
• two support frames on the first surface of the base, each support frame of the two support frames located outside the lithography frame region, each support frame of the two support frames including a support frame body having a third surface and a fourth surface opposite the third surface, the two support frames spaced apart by a third dimension that is greater than the second dimension;
• and
• a plurality of spaced apart pin supports that extend outward from the third surface of each respective support frame body of the two support frames, each pin support of the plurality of pin supports including a workpiece contact surface spaced apart from the third surface of a corresponding support frame body;
• wherein each support frame of the two support frames and each pin support of the plurality of pin supports are overlapped by the semiconductor wafer and are separate from the lithography frame region such that the lithography frame region remains uncovered;
• and
• wherein an underside of the semiconductor wafer contacts the workpiece contact surfaces of the plurality of pin supports outside the lithography frame region, and the plurality of pin supports are configured to support the semiconductor wafer in a position with the workpiece contact surfaces spaced apart from the respective support frame body of the two support frames.

A method, comprising:

• delivering a semiconductor wafer to a workpiece support, the workpiece support including a base having a first surface, a second surface opposite the first surface, and a pair of support frame bodies on the first surface, each support frame body of the pair of support frame bodies including a plurality of spaced apart spacers that extend outward from each respective support frame body, the plurality of spaced apart spacers being pin supports, the semiconductor wafer including a lithography frame region having a length dimension and a width dimension defining an area for circuit lithography;
• contacting an underside of the semiconductor wafer outside the lithography frame region with the plurality of pin supports, the plurality of pin supports extending outward from a respective surface of each support frame body of the pair of support frame bodies;
• and
• overlapping the pair of support frame bodies and the plurality of pin supports with portions of the semiconductor wafer lying outside the lithography frame region so that the lithography frame region remains uncovered, each pin support of the plurality of pin supports including a workpiece contact surface spaced apart from a corresponding respective surface of each support frame body, and the plurality of pin supports spacing apart the underside of the semiconductor wafer from each respective surface of the respective support frame body of the pair of support frame bodies.