Optical multi-chip interconnect bridge architecture and fabrication processes

Abstract

System in package (SiP) architectures using stitched reticle photonic integrated circuits (PICs), including a multi-die interconnect bridge (OMIB), are disclosed along with corresponding fabrication processes. A stitched multi-reticle OMIB provides an optically-enabled bridge between semiconductor dies referred to generally as XPUs where “X” is a variable representing a wide range of specialized processing units. The optically-enabled bridge enables high-speed, low-latency, and power-efficient communications using light to meet the bandwidth demands of modern artificial intelligence (AI) workloads. The disclosed SiP architectures use stacked arrangements in which the OMIBs are located directly under heat-producing elements of the XPUs. By using temperature-stable optical modulation elements, optical chip-to-chip (oC2C) interconnects between the OMIB and XPUs are able to be located at the point of compute in the XPUs without requiring access to the limited “beachfront” of the die that are utilized for electrical chip-to-chip (eC2C) interconnects.

Dependencies are inferred from the claim text.