A method of fabricating a deposition mask, the method comprising:
- forming a first photoresist pattern including first holes and a second photoresist pattern including second holes on a first surface and a second surface of a mask body, respectively, the first surface and the second surface opposing each other;
- and
- etching the mask body including:
- defining first recesses at an upper portion of the mask body through the first holes;
- and
- defining second recesses connected to each of the first recesses at a lower portion of the mask body through the second holes,
- wherein each of the second holes has a width smaller than a width of each of the first holes, and each of the second recesses has a width larger than a width of each of the first recesses.