Curable composition and cured product
AssigneeKaneka Corporation
InventorsTetsuya Kogiso, Akira Kikuzawa
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AssigneeKaneka Corporation
InventorsTetsuya Kogiso, Akira Kikuzawa
Estimating the term…
A curable composition that provides a cured product having both a low dielectric loss tangent and excellent adhesion to a copper foil, a cured product of the curable composition, a metal-clad laminate provided with a metal layer and a substrate containing the cured product, and a method for producing the curable composition are provided. The curable composition contains a modifier (A), a modified polyphenylene ether (B), and a radically polymerizable compound (C). The modifier (A) includes core-shell polymer particles (A2) and a modified styrene-based elastomer (A1-1) as a modified resin (A1). A common polar group is included in the modified resin (A) and the core-shell polymer particles (A2). The modified polyphenylene ether (B) has a carbon-carbon unsaturated double bond-containing group that is bound to an oxygen atom at a terminal of the molecule chain.
A curable composition comprising:
Dependencies are inferred from the claim text.