Pipette Tip Support Card Bundles

An interleaved support card bundle comprising:

• a first support card comprising a first top surface containing a first plurality of pipette tip support holes arranged in a first array, a first plurality of pipette tips seated in the first plurality of pipette tip support holes and extending away from the first top surface in a first direction, a plurality of receiver slots formed in an underside of the first support card opposite the first top surface, each receiver slot having a receiver slot wall, and a first support structure extending from the first support card in the first direction a distance less than an extension length of the first plurality of pipette tips;
• a second support card comprising a second top surface substantially parallel to the first top surface and containing a second plurality of pipette tip support holes arranged in a second array that is offset relative to the first array, a second plurality of pipette tips seated in the second plurality of pipette tip support holes and extending away from the second top surface in a second direction opposite the first direction, and a second support structure extending from the second support card in the second direction a distance less than an extension length of the second plurality of pipette tips;
• wherein the first plurality of pipette tips and the second plurality of pipette tips interleave with one another in a region between the first top surface and the second top surface without contacting one another;
• wherein distal ends of the second plurality of pipette tips are received in the plurality of receiver slots with clearance such that the receiver slot walls laterally constrain the distal ends without the distal ends contacting the first support card or binding against the receiver slot walls, thereby preventing contact between the first and second pluralities of pipette tips and maintaining alignment of the pipette tips within their respective support holes during shipping and handling;
• and
• wherein a distal edge of the first support structure abuts a distal edge of the second support structure, thereby defining a spacing between the first and second top surfaces and structurally connecting the first and second support cards as the interleaved support card bundle.

A method of manufacturing pipette tips, the method comprising:

• forming a plurality of pipette tips by a molding or forming process;
• providing a support card having a top surface with a plurality of pipette tip support holes extending therethrough and an underside with a plurality of receiver slots, each receiver slot being substantially coaxially aligned with a corresponding support hole;
• while the formed pipette tips remain in a formable or uncured state, inserting each pipette tip into a respective support hole such that a distal end of the pipette tip enters the corresponding receiver slot and is laterally constrained by a wall of the receiver slot, thereby maintaining the pipette tip in a plumb orientation relative to the top surface;
• and
• permitting the pipette tips to cure or set while held in the plumb orientation by the support card and receiver slots.