Micro-electro mechanical system device structure and semiconductor structure

A micro-electro mechanical system (MEMS) device structure, comprising:

• a frame structure having a first side and a second side opposite to the first side, and a height of the second side is greater than a height of the first side;
• a support structure coupled with the frame structure, the support structure comprises a plurality of blocks within the first side and the second side of the frame structure from a cross-sectional view perspective;
• and
• a cap structure over the support structure, comprising:
• a plurality of caps disposed over the support structure, and a protrusion of each of the plurality of cap spans at least one of the blocks of the support structure,
• wherein an upper surface of the plurality of caps is higher than an upper surface of the first side of the frame structure.

A semiconductor structure, comprising:

• a substrate;
• and
• a heat dissipation structure over the substrate, comprising:
• an outer frame structure disposed on the substrate;
• an inner frame structure adjacent to the outer frame structure;
• a support structure having a plurality of blocks suspended over the substrate from a cross-sectional view perspective;
• and
• a cap structure over the support structure, the cap structure comprises a first protrusion spans at least one of the plurality of blocks of the support structure,
• wherein a distance between a bottom surface of the first protrusion and a top surface of the at least one of the plurality of blocks spanned by the first protrusion is in a range from about 10 μm to about 30 μm.