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AssigneeASM IP Holding B.V.
InventorDongyang Chen
Estimating the term…
A jig for teaching substrate handling in a semiconductor processing system includes a verification pin with a pin width and a disc body. The disc body has a first surface, a second surface opposite the first surface, and a thickness separating the second surface from the first surface of the disc body. The first and second surfaces define a verification aperture coupling the first surface to the second surface of the disc body. The verification aperture has an aperture width equivalent to the pin width of the verification pin to teach a transfer position by slidably receiving the verification pin in the verification aperture and a verification pin seat defined in a load lock of the semiconductor processing system while supported by a substrate transfer robot within the semiconductor processing system. Semiconductor processing systems and methods of teaching substrate handling in semiconductor processing systems are also described.
A method of teaching substrate handling in a semiconductor processing system, the method comprising:
A method of teaching substrate handling in a semiconductor processing system using a jig that comprises a verification pin and a disc body, the disc body comprising a verification aperture, the method comprising:
A method of teaching substrate handling in a semiconductor processing system using a jig that comprises a verification pin and a disc body, the disc body comprising a verification aperture, the method comprising:
Dependencies are inferred from the claim text.