Integrated circuit structures having trench contact links
AssigneeIntel Corporation
InventorsReken PATEL, Sunzida FERDOUS, Guanqun CHEN, Conor P. PULS, Krishna GANESAN, Tofizur RAHMAN, Maria STANCESCU, Seonghyun PAIK, Oleg GOLONZKA, Ramanan EHAMPARAM, Clay MORTENSEN, Supanee SUKRITTANON, Mitu Chandra ACHARJEE
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