Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsToshiki SUZUKI, Yasunori AGATA, Tohru SHIRAKAWA
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AssigneeFuji Electric Co., Ltd.
InventorsToshiki SUZUKI, Yasunori AGATA, Tohru SHIRAKAWA
Estimating the term…
There is provided a semiconductor device including: an emitter electrode which is provided above an semiconductor substrate, and which has a first main region, a second main region, and a third main region; a gate pad which is provided above the semiconductor substrate; a gate metal layer which is electrically connected to the gate pad; and a gate runner portion which is electrically connected to the gate metal layer, in which a plurality of trench portions have a plurality of gate trench portions, the emitter electrode has a first emitter bridge portion which connects the first main region to the second main region, and a second emitter bridge portion which connects the second main region to the third main region, and below the first emitter bridge portion, a gate trench portion different from a gate trench portion which is provided below the second emitter bridge portion is provided.
A semiconductor device comprising:
Dependencies are inferred from the claim text.