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US 2026/0304805 A1Published application
Semiconductor structure and method of manufacturing the same
AssigneeWinbond Electronics Corp.
InventorKai-Ping CHEN
Life of this patent
Estimating the term…
Abstract
A semiconductor structure includes a substrate, a plurality of columnar supporters, and a plurality of capacitor structures. The columnar supporters are disposed over the substrate. The outer sidewall of each of the columnar supporters includes a plurality of supporting portions and a plurality of connecting portions. The capacitor structures are disposed on the supporting portions of the outer sidewalls of each of the columnar supporters, and the connecting portions connect the capacitor structures.
Claims20
A semiconductor structure, comprising:
- a substrate;
- a plurality of columnar supporters disposed over the substrate, wherein outer sidewalls of each of the columnar supporters comprise a plurality of supporting portions and a plurality of connecting portions;
- and
- a plurality of capacitor structures disposed on the supporting portions of the outer sidewalls of each of the columnar supporters, and the connecting portions connect the capacitor structures.
1 more element
A method of manufacturing a semiconductor structure, comprising:
- forming a plurality of columnar supporters on a substrate, wherein outer sidewalls of each of the columnar supporters comprise a plurality of supporting portions and a plurality of connecting portions;
- and
- forming a plurality of capacitor structures on the supporting portions of the outer sidewalls of each of the columnar supporters, wherein the connecting portions connect the capacitor structures.
Dependencies are inferred from the claim text.