Conductive film and method for producing the same
AssigneeSeiren Co., Ltd.
InventorsTakayuki NOSAKA, Masatoshi GOTO, Koki TSUGE
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Abstract
An object of the present invention is to provide a lightweight conductive film useful for an electromagnetic wave shielding material, which does not cause cracks in the metal layer even when subjected to molding processing. A conductive film having a resin film and a metal layer wherein the ratio of the amount of copper applied per unit area (g/m2) to the amount of tin applied per unit area (g/m2) [Cu/Sn] is 0.15 or less, and the average grain size of the tin crystals constituting the tin layer is 5.0 μm or more is obtained by laminating a copper layer and a tin layer in this order on at least one side of a resin film.
Claims12
A conductive film having a resin film and a metal layer in which a copper layer and a tin layer are laminated in this order on at least one side of said resin film, wherein the ratio of the amount of copper applied per unit area (g/m2) to the amount of tin applied per unit area (g/m2) [Cu/Sn] is 0.15 or less, and the average grain size of the tin crystals constituting the tin layer is 5.0 μm or more.
Dependencies are inferred from the claim text.