US 2026/0304713 A1 · HEAT DISSIPATION ASSEMBLY STRUCTURE

Abstract

A heat dissipation assembly structure is disclosed and includes a circuit board, a power module, a semiconductor device, CPO devices, a substrate and a heat dissipation component. The circuit board includes a first surface and a second surface. The power module is disposed on the first surface. The semiconductor device is disposed on the second surface and spatially corresponding to the power module. The power module and the semiconductor device are electrically connected through the circuit board. The CPO devices are disposed on the second surface and arranged adjacent to the semiconductor device. The substrate includes an opening, a third surface and a fourth. The opening passes through the third surface and the fourth surface, the fourth surface faces the first surface, and the power module is exposed through the opening. The heat dissipation component includes a first heat dissipation element thermally coupled to the power module.

Claims22

Dependent claims

A heat dissipation assembly structure, comprising:

a circuit board, comprising a first surface and a second surface arranged opposite to each other;
a power module, disposed on the first surface of the circuit board;
a semiconductor device, disposed on the second surface of the circuit board and spatially corresponding to the power module, wherein the power module and the semiconductor device are electrically connected through the circuit board;
a plurality of CPO devices, disposed on the second surface of the circuit board and arranged adjacent to the semiconductor device;
a substrate, comprising an opening and a third surface and a fourth surface arranged opposite to each other, wherein the opening passes through the third surface and the fourth surface, the fourth surface faces the first surface of the circuit board, and a contact surface of the power module is exposed through the opening;
and
a heat dissipation component, comprising a first heat dissipation element, wherein the first heat dissipation element is thermally coupled to the contact surface of the power module.

4 more elements

Dependencies are inferred from the claim text.

Heat dissipation assembly structure

Life of this patent

Heat dissipation assembly structure

Life of this patent

Abstract

Claims22