Hybrid immersion cooling
AssigneeNortek Air Solutions, LLC
InventorPatrick Alexander von zur Muehlen
Life of this patent
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Abstract
An immersion liquid cooling device includes a base, a cover, a liquid inlet, and a liquid outlet. The base is configured to be connected to one of two major surfaces of a motherboard and to surround one or more heat generating components connected to the motherboard. The cover is connected to the base. The base, the cover, and a portion of the one of two major surfaces of the motherboard form a sealed liquid cooling chamber. A dielectric liquid is configured to flow into and out of the cooling chamber through the liquid inlet and the liquid outlet.
Claims25
An immersion liquid cooling device comprising:
- a base configured to be connected to one of two major surfaces of a motherboard and to surround one or more heat generating components connected to the motherboard;
- a cover connected to the base, the base, the cover, and a portion of the one of two major surfaces of the motherboard forming a sealed liquid cooling chamber;
- and
- a liquid inlet and a liquid outlet through which a dielectric liquid is configured to flow into and out of the cooling chamber.
An immersion liquid cooling device comprising:
- a first enclosure configured to be connected to one of two major surfaces of a motherboard and to surround one or more heat generating components connected to the one of two major surfaces of the motherboard;
- a second enclosure configured to be connected to another of the two major surfaces of the motherboard opposite of the one of two major surfaces of the motherboard, the first enclosure and the second enclosure being fluidically connected and forming a sealed liquid cooling chamber;
- and
- a liquid inlet and a liquid outlet through which a dielectric liquid is configured to flow into and out of the cooling chamber.
A method of cooling an electronic device, the method comprising:
- enclosing fewer than all of a plurality of heat generating components connected to a motherboard in a sealed liquid cooling chamber of an immersion liquid cooling device connected to the motherboard;
- and
- circulating a dielectric liquid through the cooling chamber to cool the fewer than all of the plurality of heat generating components.
Dependencies are inferred from the claim text.