Packaging of kinetic inductance travelling-wave parametric amplifier (ktwpa) device

A method of fabricating a kinetic inductance travelling-wave parametric amplifier (KTWPA) device, the method comprising;

• providing a metallic enclosure having a base including an inside top surface, sides, and an enclosure lid, the metallic enclosure forming a cavity;
• coupling a substrate to the inside top surface of the base, the substrate including a plurality of conductive pads;
• coupling a silicon die to the substrate, the silicon die including a superconducting transmission line;
• coupling a bottom end of each of a plurality of conductive spacers to the silicon die;
• coupling a plurality of wire bonds between the plurality of conductive pads and the silicon die;
• and
• coupling a copper lid to a top end of each of the plurality of conductive spacers, wherein the copper lid is electrically and thermally coupled to the enclosure lid.

A quantum microwave measurement circuit, comprising:

• a kinetic inductance travelling-wave parametric amplifier (KTWPA) device having an input port and an output port, the KTWPA device further including:
• a metallic enclosure having a base including an inside top surface, sides, and an enclosure lid, the metallic enclosure forming a cavity;
• a substrate coupled to the inside top surface of the base, the substrate including a plurality of conductive pads;
• a silicon die including a superconducting transmission line, the silicon die coupled to the substrate, the superconducting transmission line further coupled to the input port and to the output port;
• a plurality of conductive spacers, each having a top end and a bottom end, the bottom end of the plurality of conductive spacers coupled to the silicon die;
• a plurality of wire bonds coupled between the plurality of conductive pads and the silicon die;
• and
• a copper lid coupled to the top end of the plurality of conductive spacers, wherein the copper lid is electrically and thermally coupled to the enclosure lid;
• a first circulator coupled to a quantum circuit to receive a quantum measurement signal;
• a first microwave triplexer coupled to the first circulator to receive the quantum measurement signal and further coupled to the input port of the KTWPA device, the first microwave triplexer receiving a bias-in voltage and a microwave pump-in signal;
• a second microwave triplexer coupled to the output port of the KTWPA device to receive an amplified quantum measurement signal, the second microwave triplexer receiving a bias-out voltage and a microwave pump-out signal;
• a second circulator coupled to the second microwave triplexer to receive the amplified quantum measurement signal;
• and
• an analog-to-digital converter (ADC) coupled to the second circulator to receive the amplified quantum measurement signal and provide a quantum measurement value, wherein the KTWPA device, the first circulator, the second circulator, the first microwave triplexer and the second microwave triplexer are cooled to less than 100 mK.