Surface-emitting element
AssigneeSony Semiconductor Solutions Corporation
InventorsHiroki YOKOYAMA, Shunya KAWAMURA, Tomohiro YOKOTA, Hiroki KUDO, Ryo ITO, Hidekazu AOYAGI
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AssigneeSony Semiconductor Solutions Corporation
InventorsHiroki YOKOYAMA, Shunya KAWAMURA, Tomohiro YOKOTA, Hiroki KUDO, Ryo ITO, Hidekazu AOYAGI
Estimating the term…
To provide a surface-emitting element capable of suppressing occurrence of cracks due to an oxide confinement layer during driving and/or mounting. A surface-emitting element according to the present technology includes a first structure including a first semiconductor structure, a second structure stacked with the first structure and including a second semiconductor structure, and a third structure arranged between the first and second structures and including a light-emitting layer, in which an oxide confinement layer is provided between a surface of the first structure on a side opposite a light-emitting layer side and the light-emitting layer and/or between a surface of the second structure on a side opposite the light-emitting layer side and the light-emitting layer, the oxide confinement layer including a non-oxidized region, and an oxidized region surrounding at least a part of the non-oxidized region, and the oxidized region has a plurality of tapered portions whose thickness decreases toward inner peripheral ends. With the surface-emitting element according to the present technology, a surface-emitting element capable of suppressing occurrence of cracks due to an oxide confinement layer during driving and/or mounting can be provided.
A surface-emitting element comprising:
Dependencies are inferred from the claim text.