Millimeter-wave antenna
AssigneeTexas Instruments Incorporated
InventorsMohammad Varnoosfaderani Varnoosfaderani, Thomas Kronenberg, Harshpreet Bakshi, Rajen Manicon Murugan
Life of this patent
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Abstract
A semiconductor package includes a flat no-leads interconnect and a dipole antenna formed from a ground plane of the flat no-leads interconnect. The semiconductor package also includes a plurality of wire bonds surrounding the dipole antenna to form an RF (radio frequency) shielding cavity and a mold compound encapsulating the dipole antenna, the wire bonds and a portion of the flat no-leads interconnect.
Claims20
A semiconductor package comprising:
- a flat no-leads interconnect;
- a dipole antenna formed from a ground plane of the flat no-leads interconnect;
- a plurality of wire bonds surrounding the dipole antenna to form an RF (radio frequency) shielding cavity;
- and
- a mold compound encapsulating the dipole antenna, the wire bonds and a portion of the flat no-leads interconnect.
A millimeter-wave device comprising:
- a flat no-leads semiconductor package comprising:
- an interconnect having leads and a ground plane;
- a semiconductor die mounted on the ground plane of the interconnect;
- a dipole antenna formed from the ground plane of the interconnect and electrically connected to the semiconductor die;
- a plurality of wire bonds circumscribing the dipole antenna to form an RF (radio frequency) shielding cavity;
- and
- a mold compound encapsulating the dipole antenna, the die and a portion of the interconnect;
- and
- a PCB (printed circuit board) comprising an AMC (artificial magnetic conductor) structure positioned below the dipole antenna.
A method of fabricating a semiconductor package, comprising:
- mounting a semiconductor die on a ground plane of a flat no-leads interconnect;
- forming a dipole antenna from the ground plane of the flat no-leads interconnect;
- placing wire bonds circumscribing the dipole antenna to create a cavity for shielding the dipole antenna;
- and
- encapsulating the semiconductor die, the dipole antenna, the wire bonds and a portion of the interconnect in a mold compound.
Dependencies are inferred from the claim text.