Silver Oxide Particles, Silver Oxide Powder, Bonding Composition, Silver Oxide Paste, Method for Producing Semiconductor Device Using Said Bonding Composition or Said Silver Oxide Paste, and Method for Producing Silver Oxide Particles or Silver Oxide Powder

Abstract

The present invention provides a bonding material that achieves good bonding strength even when bonding at low temperatures. Flake-shaped silver oxide particles or a silver oxide powder containing the particles are provided. The flake-shaped silver oxide particles have an average thickness of 10 to 100 nm and a D50 of 100 to 350 nm. Moreover, the flake-shaped silver oxide particles or silver oxide powder containing the particles may be used as a paste for bonding a semiconductor substrate with, for example, a power semiconductor chip.

Dependencies are inferred from the claim text.