Cleaning structure surface in light source chamber
AssigneeASML Netherlands B.V.
InventorsPitam Mitra, John Charles Hirschy Wick
Life of this patent
Estimating the term…
Abstract
An apparatus includes: a component of a chamber of an extreme ultraviolet (EUV) light source, the component including at least one exposed surface; and a cleaning apparatus configured to remove target debris from the exposed surface of the component without separating the component from the chamber. The cleaning apparatus includes: one or more surface-wave plasma (SWP) generators, with each SWP generator being disposed in a groove formed in the exposed surface of the component; and, for each SWP generator, a shield placed between the chamber and the SWP generator. The shield, the SWP generator, and the exposed surface define at least one open channel between the SWP generator and the chamber, the open channel extending across the groove.
Claims24
An apparatus comprising:
- a component of a chamber of an extreme ultraviolet (EUV) light source, the component including at least one exposed surface;
- and
- a cleaning apparatus configured to remove debris from the exposed surface of the component without separating the component from the chamber, the cleaning apparatus comprising:
- one or more surface-wave plasma (SWP) generators, with each SWP generator being disposed in a groove formed in the exposed surface of the component;
- and
- for each SWP generator, a shield placed between an interior of the chamber and the SWP generator;
- wherein the shield, the SWP generator, and the exposed surface define at least one open channel between the SWP generator and the interior of the chamber, the open channel extending across the groove.
A method of cleaning an exposed conductive surface of a component of a chamber of an extreme ultraviolet (EUV) light source, the method comprising:
- removing debris from the exposed conductive surface of the component without separating the component from the chamber, the removing comprising:
- generating microwave radiation from an antenna that extends axially along a groove formed within the exposed conductive surface;
- enabling the microwave radiation to ionize gas present at the exposed conductive surface to form a surface-wave plasma (SWP) at the exposed conductive surface of the component;
- enabling the SWP to spread along the exposed conductive surface such;
- and
- shielding the antenna from EUV radiation within the chamber and dissipating heat away from the antenna.
An apparatus comprising:
- a gas flow apparatus configured to direct debris to an exhaust opening of a light source;
- and
- a cleaning apparatus configured to remove the debris at an interior surface in a chamber of the light source, the cleaning apparatus comprising an etching device configured to etch the debris deposited on the interior surface.
Dependencies are inferred from the claim text.