System and method for flow-through atomic layer deposition on semiconductor processing tool components

A method for coating an inner surface of a semiconductor processing tool component comprising:

• vaporizing a precursor to obtain a vaporized precursor;
• flowing the vaporized precursor through a system comprising
• a plurality of semiconductor processing tool components, each of the plurality of semiconductor processing tool components having a first end, a second end, an inner surface, and an outer surface,
• an inlet manifold fluidly connected to the first end of each of the plurality of semiconductor processing tool components,
• an outlet manifold fluidly connected to the second end of each of the plurality of semiconductor processing tool components, and
• a heater element enclosing the plurality of semiconductor processing tool components, wherein the heater element controls a target temperature of each of the plurality of semiconductor processing tool components,
• wherein the vaporized precursor is flowed through the system under atomic layer deposition processing conditions;
• and
• forming an ALD coating on the inner surface of each of the semiconductor processing tool components.